| 摘要 |
<p>PURPOSE: To improve the production efficiency, and to provide a method for manufacturing a multilayer printed circuit board in which the steps are omitted by obtaining a circuit having high reliability. CONSTITUTION: A lowermost insulating board 1d, an uppermost insulating board 1u disposed on the board 1d and predetermined number of inner layer circuit boards in disposed between the boards 1u and 1d are pressure adhered via adhesive sheets 8 to a laminate 10. A through hole 3 is formed at the laminate 10, a metal film having smaller etching solubility than that of copper is formed as a conductor protective layer 8 on the exposed surface of the exposed conductor circuit 4, a chemical copper plating 11 is provided in the hole 3, tented by filmlike etching resist 9 at the upper and lower ends of the hole 3 to block the hole 3, and then the plating 11 exposed by etching is removed.</p> |
