| 摘要 |
An assembly of members having different amount of thermal stress is provided to obtain economical merits by replacing only a damaged part of an assembly. A first member(10) is installed in equipment for a semiconductor fabricating process. A second member(20) is coupled to the first member, having different thermal expansion amount than that of the first member. The second member has a coupling groove part(23) composed of an inlet part(21) and a bottom part(22) downward extended from the inlet part wherein the bottom part has a broad cross-sectional area as compared with the breadth of the cross-sectional area of the inlet part. A sleeve(30) is fixed to the first member, including a main part(31) inserted into the inlet part of the coupling groove part and a plurality of elastic pieces installed along the circumferential direction of the main part wherein the elastic pieces are separated from each other. The elastic pieces are downward extended from the main part to be inserted into the bottom part of the coupling groove part, capable of being elastically transformed in a direction that approaches or goes away from the center of the main part. The second member is a porous gas distribution plate made of a silicon material. The first member is a support ring made of a graphite material to fix the gas distribution plate.
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