| 摘要 |
<p>An epoxy resin composition comprising an epoxy resin (A), a curing agent (B), and an inorganic filler, wherein the curing agent (B) is one containing at least two phenolic and/or naphtholic hydroxyl groups in its molecule and the inorganic filler contains silica (C) as the essential ingredient, the silica comprising 1-99 wt.% of synthetic silica and 99-1 wt.% of molten natural silica; and a semiconductor device comprising semiconductor elements sealed therewith. The composition does not cause failure in resin filling, resin peeling, resin streak, stage shift and vent clogging in the molding step. The sealed semiconductor device is excellent in moisture-resistance reliability, high-temperature reliability and soldering resistance.</p> |
