| 摘要 |
<p>There is disclosed a self-dispersing curable epoxy resin composition comprising the addition product of reactants comprising (a) 1.0 reactive equivalents epoxy resin, (b) from about 0.01 to 1.0 reactive equivalents of a polyhydric phenol, and (c) from 0.005 to 0.5 reactive equivalents of an amine-epoxy adduct comprising the addition product of reactants comprising 1.0 reactive equivalents of a polyepoxide and from about 0.3 to 0.9 reactive equivalents of a polyoxyalkylenediamine having blocks of unsubstituted and monosubstituted ethoxy groups in random and/or block configuration.</p> |
