| 摘要 |
A light emitting diode package and a manufacturing method thereof are provided to make a thin package by using an external frame made of silicon. An electrode pad(113,115) is formed on a base substrate(111). A silicon frame(101a) with a device receiving hole(103) of the container shape is attached to the base substrate. The silicon frame is adhered on the base substrate by using adhesive. The device receiving hole of the container shape has a reflective surface(105) with a circumference inclined to an external direction above 90 to 160 degrees with regard to the bottom. After connecting a light emitting diode(121) to the electrode pad by a wire(122), the transparency molded member containing the fluorescent substance is filled and cured in the device receiving hole of the container shape. The electrode pad of the base substrate is electrically connected to both terminals of the electrode pad. |
