发明名称 |
Leadframe for a semiconductor device |
摘要 |
A leadframe (40) for a semiconductor device has a radially extending leads (42) having inner lead portions (44) and outer lead portions (46), and a dam bar (48) that mechanically connects the leads (42) together near the outer lead portions (46). The inner lead portions (44) define an open area having a central region and the dam bar (48) defines a leadframe outer perimeter. A generally X-shaped die support member has arms (50) that extend from the leadframe outer perimeter and meet at the central region. A heat sink includes sections (64) that are formed between adjacent pairs of the die support member arms (50). The heat sink sections (64) are connected to the die support member arms (50) with down set tie bars (66) such that the heat sink lays in a plane below a plane of the die support member arms (50). |
申请公布号 |
US7482679(B2) |
申请公布日期 |
2009.01.27 |
申请号 |
US20050569113 |
申请日期 |
2005.10.14 |
申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
ARIPIN AZHAR;SARIYO NORSAIDI |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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