发明名称 Power integrated circuit
摘要 <p>Conventional vertical components can be formed directly in the n-substrate having rear face covered with metallisation (M) corresp. to a common electrode. One type of isolated component has an active layer of opposite conductivity type on the rear face and is isolated by relatively heavily doped walls (6) which are overlapped by the dielectric layer (7) between the active layer and the metallisation.</p>
申请公布号 EP0721218(A1) 申请公布日期 1996.07.10
申请号 EP19950410150 申请日期 1995.12.27
申请人 STMICROELECTRONICS S.A. 发明人 PEZZANI, ROBERT
分类号 H01L27/04;H01L29/73;H01L21/331;H01L21/761;H01L21/822;H01L21/8222;H01L23/40;H01L27/06;H01L27/08;H01L29/732;H01L29/739;H01L29/74;H01L29/78;H01L29/861;H05K7/20;(IPC1-7):H01L27/08 主分类号 H01L27/04
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