| 发明名称 |
HYBRID IC STRUCTURE |
| 摘要 |
The structure of hybrid IC is provided to increase productivity and reliability by forming a heat sink projection, and comprises several heat sink projections(4) below the substrate(1) on which a component(2) and leads(3) are fixed.
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| 申请公布号 |
KR960009111(B1) |
申请公布日期 |
1996.07.10 |
| 申请号 |
KR19930019488 |
申请日期 |
1993.09.23 |
| 申请人 |
LG ELECTRONIC COMPONENTS CO., LTD. |
发明人 |
LEE, WON - JO |
| 分类号 |
H01L23/12;H05K7/20;(IPC1-7):H01L23/12 |
主分类号 |
H01L23/12 |
| 代理机构 |
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