发明名称
摘要 PURPOSE:To prevent lowering of binding force with a copper foil at a high temperature by directly jointing a film of polyimide able flowable at a high temperature and constituting of a repeating unit expressed by a specific formula with the copper foil with no adhesive agent. CONSTITUTION:A film of polyimide flowable at a high temperature and consisting of a repeating unit expressed by a formula is directly jointed with a copper foil with no adhesive agent. Here, in the formula, R expresses a radical of quadrivalence selected from a group consisting of a fat group radical, a ring fat group radical, a monocyclic aromatic group radical, a contraction polycyclic aromatic radical and a non-condensation polycyclic aromatic radical where aromatic radicals are directly or by a cross-linking member each other linked. Further, X expresses a formula II. That is, flowable polyimide obtained from a special diamine and acid dianhyaride is excellent in heat resistance and has a strong in binding force at a high temperature with a copper foil.
申请公布号 JP2514313(B2) 申请公布日期 1996.07.10
申请号 JP19940154587 申请日期 1994.07.06
申请人 MITSUI TOATSU CHEMICALS 发明人 OOTA MASAHIRO;KAWASHIMA SABURO;SONOBE YOSHIO;TAMAI MASAJI;OIKAWA HIDEAKI;YAMAGUCHI TERUHIRO
分类号 C08G73/10;B32B15/08;B32B15/088;C09J179/08;H05K1/00;H05K1/03;H05K3/02;H05K3/38;(IPC1-7):H05K1/03 主分类号 C08G73/10
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