| 发明名称 |
A soft metal conductor and method of making |
| 摘要 |
<p>A soft metal conductor for use in a semiconductor device that has an upper-most layer consisting of grains having grain sizes sufficiently large so as to provide a substantially scratch-free surface upon polishing in a subsequent chemical mechanical polishing step. <IMAGE></p> |
| 申请公布号 |
EP0721216(A2) |
申请公布日期 |
1996.07.10 |
| 申请号 |
EP19950119793 |
申请日期 |
1995.12.15 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
JOSHI, RAJIV, VASANT;TEJWANI, MANU JAMNADAS |
| 分类号 |
H01L21/28;H01L21/304;H01L21/3205;H01L21/768;H01L23/52;H01L23/522;H01L23/532;H01L29/43;(IPC1-7):H01L23/532 |
主分类号 |
H01L21/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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