| 发明名称 |
Semiconductor body having metallization with good adherence |
| 摘要 |
<p>To produce a metallisation with good adherence on a semiconductor surface, it is proposed to site the metallisation in trenches which have at least one textured trench boundary surface. <IMAGE></p> |
| 申请公布号 |
EP0567764(B1) |
申请公布日期 |
1996.07.10 |
| 申请号 |
EP19930104475 |
申请日期 |
1993.03.18 |
| 申请人 |
SIEMENS SOLAR GMBH |
发明人 |
HOLDERMANN, KONSTANTIN |
| 分类号 |
H01L31/0224;H01L31/0236;(IPC1-7):H01L31/022;H01L31/023 |
主分类号 |
H01L31/0224 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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