The method of putting solder ball safely on the package of the integrated circuit uses the putting means as many as the solder ball putting hole (10) in order to put many solder balls (27) into the solder ball holes (10) correctly while all the solder balls are put in simultaneously.
申请公布号
KR960009104(B1)
申请公布日期
1996.07.10
申请号
KR19930015983
申请日期
1993.08.18
申请人
ANAM IND. CO., LTD.
发明人
HU, YOUNG - WOOK;HAN, KYUNG - HEE;SIM, ILL - KWON;RYU, JAE - JIN;YEUM, DONG - SHIN;SONN, JOO - YOUNG;KIM, JIN - CHUN;HWANG, INN - SUN;EUM, SE - JIN;CHON, CHOON - BAE
