摘要 |
PURPOSE: To obtain a composite plate having stable quality without any warpage at a low cost by setting a coefficient of terminal expansion of a sheet molded from a sheet molding compound(SMC) within a range of a specific value of a coefficient of thermal expansion of a zinc plate and simultaneously making both the molded sheet from the SMC and the zinc plate in one piece at the time of molding the SMC with a resin coating film therebetween. CONSTITUTION: A coefficient of thermal expansion of a sheet molded from a sheet molding compound(SMC) is set within a range of±20% of a coefficient of thermal expansion of a zinc plate. The molded sheet from the SMC and the zinc plate are made in one piece simultaneously at the time of molding the SMC with a resin coating film therebetween. The SMC comprises 5-30wt.% of a glass fiber and 95-75wt.% of a mixture composed of 30-50 pts. wt. of an unsaturated polyester, 30-60 pts.wt. of a vynil monomer, 0.1-4 pts.wt. of a low- shrinking agent, 5-150 pts.wt. of an inorganic filler, 0.5-3 pts.wt. of a curing agent, 1-7 pts.wt. of a parting agent and 0.5-5 pts.wt. of a thickener. Further, the resin coating film is a polyurethane-type thermosetting resin and is formed by applying it onto the zinc plate in a thickness of 5-100μm.
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