发明名称 |
Process for producing Semiconductor silicon wafer |
摘要 |
Provided is a process for producing a semiconductor silicon wafer by which an intrinsic gettering effect can be improved and at the same time the top side can be made free from faults. A silicon ingot is produced and sliced to obtain silicon wafers. Then, a polycrystal silicon depositing film is formed on one side of a silicon wafer, which is subjected to a heat treatment in an inert gas, a reducing gas or a mixture thereof to discharge oxygen from the vicinity of the other side. Alternatively, after discharging oxygen from the silicon wafer by a heat treatment, a polycrystal silicon depositing film may be formed on one side of the silicon wafer.
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申请公布号 |
US5534294(A) |
申请公布日期 |
1996.07.09 |
申请号 |
US19940279007 |
申请日期 |
1994.07.22 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
KUBOTA, ATSUKO;KOJIMA, MASAKATU;TSUCHIYA, NORIHIKO;SAMATA, SHUICHI;NUMANO, MASANORI;UENO, YOSHIHIRO |
分类号 |
H01L21/304;C30B15/00;C30B33/00;H01L21/322;H01L21/332;(IPC1-7):C23C16/24 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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