| 摘要 |
An integrated mounting assembly has optical fibers supported between a grooved substrate and a clamping substrate, one or both substrates being mounted to a base substrate. The base substrate also provides integrated support for a submount which carries an optoelectronic device, e.g., a laser diode. Optical coupling of the device to the optical fibers is achieved by referencing the submount to the base without need for active optical alignment of the device. Mounting of the integrated optoelectronic assembly in a housing of an optoelectronic package can be made hermetic and electromagnetically shielded.
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