发明名称 Method for etching HgCdTe substrate
摘要 A method for etching an HgCdTe substrate selectively by dry etching. A substrate is selectively etched without damaging the substrate during a simple process in which the higher selectivity of an HgCdTe substrate versus a resist mask is obtainable. Removal of the resist mask after etching is easy. The etching gas contains molecules having a bond of nitrogen and hydrogen and is formed into plasma. An HgCdTe substrate is etched with a resist film as a mask by the plasma gas.
申请公布号 US5534109(A) 申请公布日期 1996.07.09
申请号 US19940320249 申请日期 1994.10.11
申请人 FUJITSU LIMITED 发明人 FUJIWARA, KOJI;SUDO, GEN;ARINAGA, KENJI
分类号 C23F4/00;H01L21/302;H01L21/3065;H01L21/465;H01L31/18;(IPC1-7):H01L21/306;B44C1/22 主分类号 C23F4/00
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