发明名称 |
Method for etching HgCdTe substrate |
摘要 |
A method for etching an HgCdTe substrate selectively by dry etching. A substrate is selectively etched without damaging the substrate during a simple process in which the higher selectivity of an HgCdTe substrate versus a resist mask is obtainable. Removal of the resist mask after etching is easy. The etching gas contains molecules having a bond of nitrogen and hydrogen and is formed into plasma. An HgCdTe substrate is etched with a resist film as a mask by the plasma gas.
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申请公布号 |
US5534109(A) |
申请公布日期 |
1996.07.09 |
申请号 |
US19940320249 |
申请日期 |
1994.10.11 |
申请人 |
FUJITSU LIMITED |
发明人 |
FUJIWARA, KOJI;SUDO, GEN;ARINAGA, KENJI |
分类号 |
C23F4/00;H01L21/302;H01L21/3065;H01L21/465;H01L31/18;(IPC1-7):H01L21/306;B44C1/22 |
主分类号 |
C23F4/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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