发明名称 POLISHING DEVICE
摘要 PURPOSE: To provide a polishing device which is constituted to uniformly polish an object to be polished without using slurry. CONSTITUTION: In a polishing head which effects reciprocation in parallel to a surface to be polished and rotational movement in a surface vertical to a surface to be polished, a polishing device is provided to control the polishing pressure of a polishing tape to a constant value and uniformly polish the surface to be polished. A polishing head is provided with a drilled first L-shapes plate 32 and a vertical stretch body 21 protruded vertically from a hole. A polishing pad 22 is arranged at the tip of the first L-shaped plate and presses the polishing tape. A non-seal cylinder 34 is fixed to the vertical stretch body 21 in parallel to the first L-shaped plate 32. The pressure of a polishing pad is adjusted by one end of the non-seal cylinder. The rotation angle and the polishing pressure of a polishing head are fed as a pulse signal to a control part. To keep a polishing pressure at a constant value, the rotation angle of the motor and the feed of air to the cylinder are controlled to an optimum.
申请公布号 JPH08174399(A) 申请公布日期 1996.07.09
申请号 JP19950025794 申请日期 1995.01.23
申请人 NIPPON MICRO COATING KK 发明人 YUI MAREYOSHI
分类号 B24B21/00;B24B9/00;H01L21/304;(IPC1-7):B24B21/00 主分类号 B24B21/00
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