| 摘要 |
An IC bare chip carrier installs an IC bare chip for performing a burn-in test and a functional examination of the bare chip. The carrier consists of an installing unit for installing the bare chip and an interconnecting unit for electrically interconnecting chip electrodes of the bare chip with output electrodes of the interconnecting unit, to be connected to apparatus for the burn-in test and the functional examination. The installing unit is made of aluminium nitride having an expansion rate near of material, ceramic, of the IC bare chip, for making fabrication of installing surface of the IC bare chip easy. The interconnecting unit has an air exchange mechanism by which the IC bare chip can be laid in a space, made by combining the installing unit and the interconnecting unit, constantly filled with inert gas such as nitrogen. The IC bare chip is transported anytime and anywhere as installed in the carrier without being contaminated.
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