| 摘要 |
PURPOSE: To provide a method for cutting off a substrate material and a device thereof, which can smoothly and precisely cut off without developing dross and microcrack. CONSTITUTION: Wave length of light oscillated with carbon dioxide gas laser beam generator 121 is selected to a single wave length with a diffraction grating 112. This laser beam having single wave length is condenced and also, assist gas is flowed along the propagating direction of the laser beam on the outer periphery of this laser beam. Then, while irradiating the substrate material 141 mounted on a light transmissible plate 147 composed of a material which can transmit the laser beam, with the laser beam, the substrate material 141 is shifted to cut off the substrate material 141. |
