Method for making multichip circuits using active semiconductor substrates

摘要

In accordance with the invention, a multichip circuit is fabricated by providing an active semiconductor substrate comprising a set of isolated components including active components such as transistors, forming on a surface of the substrate a plurality of paths incorporating components from the substrate for interconnecting a plurality integrated circuit devices, and mounting the ICs on the surface in contact with their respectively appropriate paths. The preferred active substrate is similar in structure to a silicon integrated circuit except that the circuit components are interconnected only by the paths interconnecting the ICs. Advantageously the ICs are surface mounted on the substrate.