Direct contacting method for component to carrier

摘要

The directly contactable electronic component (1) has indentations. Contact sites are arranged in the indentations. In one embodiment the indentations are at the edges of the component. The component has perpendicular holes at the sites which are to be contacted and the edges are cut away. In the method of producing the component the component is indented and conductive contact areas are produced. the contact faces are in the indentations. The surfaces of the holes produced at the contact sites are metallised.