| 摘要 |
<p>A process for the corrosion protection of copper or copper alloy which process comprises contacting the surface with an aqueous solution of at least one compound of general formula (I), wherein X is N, Y is CR and Z is N, or X is N, Y is N and Z is N or CR or X is CR, Y is N and Z is N, where R is a hydrogen atom or R?1, and R1¿ is an alkyl, aryl, aralkyl, halogen, trihalomethyl, amino, heterocyclic, NHR?2, NR3R4¿, CN, CO¿2?H, CO2R?5¿, OH or OR6 group, where each of R2 to R6 independently represents an alkyl, aryl, or aralkyl group.</p> |
