发明名称 Verfahren zur Herstellung eines ein Kupferelement enthaltenden Verbundgegenstandes.
摘要 <p>To make a composite article comprising a copper element (12) and an adhesive material (6) adhesively bonded to a surface thereof, the surface of the copper element is provided with a microstructure comprising knife-shaped elongate projections (14) whose opposite flanks are at an average angle of less than 60 DEG to each other. The microstructure may include rod-shaped projections much smaller than said knife-shaped projections projecting outwardly from the surface of said knife-shaped projections. The knife-shaped projections may be formed by electroless plating and the rod-shaped projections by oxidation and optionally reduction. Bonding strength is improved.</p>
申请公布号 DE68924734(T2) 申请公布日期 1996.07.04
申请号 DE1989624734T 申请日期 1989.07.20
申请人 HITACHI, LTD., TOKIO/TOKYO, JP 发明人 AKAHOSHI, HARUO, HITACHI-SHI IBARAKI-KEN, JP;MURAKAMI, KANJI, MITO-SHI IBARAKI-KEN, JP;SUZUKI, YOSHIHIRO, HITACHI-SHI IBARAKI-KEN, JP;NAGAI, AKIRA, HITACHI-SHI IBARAKI-KEN, JP;KOGAWA, KIYONORI, HIRATSUKA-SHI KANAGAWA-KEN, JP;TAKAHASHI, AKIO, HITACHIOHTA-SHI IBARAKI-KEN, JP
分类号 H01L21/3205;H01L23/52;H05K1/09;H05K3/38;H05K3/46;(IPC1-7):H05K3/38;C23C18/40;B32B15/08 主分类号 H01L21/3205
代理机构 代理人
主权项
地址