MULTILAYERED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a multi-layered electronic component which prevents an inner coil unit from being exposed, and implements a high capacity electronic component. The multi-layered electronic component comprises: a multi-layered main body having first and second cross sections facing each other, having first and second sides for connecting the first and second cross sections, and including a plurality of insulating layers; and an inner coil unit formed by connecting a plurality of inner coil patterns arranged on the insulating layers by a via passing through the insulating layer. The inner coil pattern is exposed to the first and second sides. First and second side units are arranged on the first and second sides.