| 摘要 |
The present invention relates to a polishing apparatus for manufacturing semiconductors and a polishing method in order to precisely polish objects such as silicon wafers and quartz as materials of manufacturing semiconductors. The polishing apparatus polishes a surface of an object after making the same face the polishing surface rotating. Also, the polishing apparatus firstly provides rough granular abrasive materials for the polishing surface and secondly provides medium rough granular abrasive materials as well as the rough granular abrasive materials. Then, after the present invention stops providing rough granular abrasive materials thirdly, only medium rough granular abrasive materials are provided. Furthermore, after fine granular abrasive materials with medium granular abrasive materials are provided fourthly, medium granular abrasive materials are stopped being provided and only fine granular abrasive materials are fifthly provided in the present invention. Since the present invention singularly or repeatedly provides abrasive materials with different granularity through a plurality of steps, excellent quality of polished surfaces can be realized while also improving polishing efficiency. |
