发明名称 |
SPUTTERING TARGET WITH ULTRA-FINE, ORIENTED GRAINS AND METHOD OF MAKING SAME |
摘要 |
A sputtering target comprising a body of metal such as aluminum and its alloy with an ultra-fine grain size and small second phase. Also described is a method for making an ultra-fine grain sputtering target comprising melting, atomizing, and depositing atomized metal to form a workpiece (60), and fabricating the workpiece (60) to form a sputtering target. A method is also disclosed that includes the steps of extruding a workpiece through a die having contiguous transverse inlet and outlet channels of substantially identical cross section, and fabricating the extruded article into a sputtering target. The extrusion may be performed several times, producing grain size of still smaller size and controlled grain texture.
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申请公布号 |
WO9620055(A1) |
申请公布日期 |
1996.07.04 |
申请号 |
WO1995US16794 |
申请日期 |
1995.12.22 |
申请人 |
JOHNSON MATTHEY ELECTRONICS, INC. |
发明人 |
DUNLOP, JOHN, ALDEN;YUAN, JUN;KARDOKUS, JANINE, KIYABU;EMIGH, ROGER, ALAN |
分类号 |
C22F1/04;B21C23/01;B22F3/115;B22F3/20;B22F3/24;C22C1/04;C22C21/00;C23C14/34;(IPC1-7):B22F3/00;B22F7/04 |
主分类号 |
C22F1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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