发明名称 SPUTTERING TARGET WITH ULTRA-FINE, ORIENTED GRAINS AND METHOD OF MAKING SAME
摘要 A sputtering target comprising a body of metal such as aluminum and its alloy with an ultra-fine grain size and small second phase. Also described is a method for making an ultra-fine grain sputtering target comprising melting, atomizing, and depositing atomized metal to form a workpiece (60), and fabricating the workpiece (60) to form a sputtering target. A method is also disclosed that includes the steps of extruding a workpiece through a die having contiguous transverse inlet and outlet channels of substantially identical cross section, and fabricating the extruded article into a sputtering target. The extrusion may be performed several times, producing grain size of still smaller size and controlled grain texture.
申请公布号 WO9620055(A1) 申请公布日期 1996.07.04
申请号 WO1995US16794 申请日期 1995.12.22
申请人 JOHNSON MATTHEY ELECTRONICS, INC. 发明人 DUNLOP, JOHN, ALDEN;YUAN, JUN;KARDOKUS, JANINE, KIYABU;EMIGH, ROGER, ALAN
分类号 C22F1/04;B21C23/01;B22F3/115;B22F3/20;B22F3/24;C22C1/04;C22C21/00;C23C14/34;(IPC1-7):B22F3/00;B22F7/04 主分类号 C22F1/04
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