| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaging structure having a high product yield rate and a manufacturing method thereof.SOLUTION: A manufacturing method of a packaging structure 100 includes the following steps of a step of providing a substrate 110 that includes a core layer 112, and a first patterned metal layer 114 and a second patterned metal layer 116 which are disposed to two surfaces opposite to the core layer; a step of forming a penetration cavity C1 that penetrates the substrate; a step of disposing the substrate onto a tape carrier; a step of disposing a semiconductor component 130 into the penetration cavity; a step of g1-defining a groove by both of an inside wall of the penetration cavity and a side face of the semiconductor component; a step of supplying a filling compound 140 to the groove; a step of performing a heating process to the filling compound, inflowing the filling compound into the tape carrier, and completely filling the groove. A first lamination layer 150 and a second lamination layer 160 are laminated to the first patterned metal layer and the second patterned metal layer, and at least one part of semiconductor component is covered with the first laminated layer and the second laminated layer.SELECTED DRAWING: Figure 1O |
