| 摘要 |
PROBLEM TO BE SOLVED: To improve heat dissipation characteristics of a semiconductor device.SOLUTION: A semiconductor device PKG1 includes, for example: a lead LD1A (P2) connected to a second part P2 of a chip mounting part (TAB1 on which a semiconductor chip CHP1 to be a heat source is mounted; and a lead LD1A(P3) connected to a third part P3 of the chip mounting part TAB1 on which the semiconductor chip CHP1 to be a heat source is mounted. Each of the lead LD1A(P2) and the lead LD1A(P3) has a projection projecting from an encapsulated body MR. With this configuration, heat dissipation characteristics of the semiconductor device PKG1 can be improved.SELECTED DRAWING: Figure 10 |
