发明名称 |
HEAT INSULATING BOARD AND HEAT INSULATING METHOD USING SAME |
摘要 |
<p>A heat insulating board and a method for heat insulation by utilizing the same based on a novel heat-insulation theory utilizing a heat gradient. And, this heat insulating board is characterized by consisting of a composite body of an opaque heat-conducting base body positioned to face the low temperature zone and a heat conductive transparent layer positioned to face the high temperature zone, the said transparent layer having a heat volume and an absorption of heat of radiation smaller than the heat volume and absorption of heat of radiation of the said base body. <IMAGE></p> |
申请公布号 |
EP0719976(A1) |
申请公布日期 |
1996.07.03 |
申请号 |
EP19940925624 |
申请日期 |
1994.09.02 |
申请人 |
KABUSHIKI KAISHA SEKUTO KAGAKU |
发明人 |
KUJIRAI, YUMIKO;KUJIRAI, MASAMI;KUJIRAI, YUKIO |
分类号 |
F28F3/00;F16L59/08;F28F13/18;F28F21/00;H01L23/373;(IPC1-7):F16L59/08 |
主分类号 |
F28F3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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