发明名称 HEAT INSULATING BOARD AND HEAT INSULATING METHOD USING SAME
摘要 <p>A heat insulating board and a method for heat insulation by utilizing the same based on a novel heat-insulation theory utilizing a heat gradient. And, this heat insulating board is characterized by consisting of a composite body of an opaque heat-conducting base body positioned to face the low temperature zone and a heat conductive transparent layer positioned to face the high temperature zone, the said transparent layer having a heat volume and an absorption of heat of radiation smaller than the heat volume and absorption of heat of radiation of the said base body. <IMAGE></p>
申请公布号 EP0719976(A1) 申请公布日期 1996.07.03
申请号 EP19940925624 申请日期 1994.09.02
申请人 KABUSHIKI KAISHA SEKUTO KAGAKU 发明人 KUJIRAI, YUMIKO;KUJIRAI, MASAMI;KUJIRAI, YUKIO
分类号 F28F3/00;F16L59/08;F28F13/18;F28F21/00;H01L23/373;(IPC1-7):F16L59/08 主分类号 F28F3/00
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