| 摘要 |
A printed circuit board (2) to which an IC package such as a TCP having a multiplicity of leads arranged with a small pitch is suitably connected by a local heating method using a bonding tool. The upper surfaces of solder layers (11) provided on lands (8) formed on the printed circuit board (2) are flattened, and leads of an electronic part to be mounted are placed on the solder layers. These members are soldered by being pressed and heated with the bonding tool. At least a region of the printed circuit board corresponding to the bottom surface of the bonding tool has a height lower than that of the leads superposed on the lands, whereby the desired parallelism of the bottom surface of the bonding tool with respect to the printed circuit board is maintained. <IMAGE> |
