发明名称 MULTILAYER CABLE AND MANUFACTURE THEREOF
摘要 <p>PURPOSE: To provide a multilayer cable in which no bump is formed even if an economical reproduced compound is used as an insulating material. CONSTITUTION: An innermost layer, an interlayer, and an outermost layer of insulating materials are successively formed on a conductor and the interlayer is formed by extrusion of a reproduced compound and the innermost layer and the outermost layer are formed by extrusion of a compound with good quality. In this cable structure, the middle density polyethylene (π= 0.935±0.05, MI=0.3) is used for the innermost layer and the outermost layer and polyethylene cross-linked with water (ρ= 0.930±0.05, MI=0.6) is used for the interlayer. The innermost layer and the outermost layer are formed by dividing extrusion from one extruder and thus the number of extruding apparatuses can be lessened.</p>
申请公布号 JPH08171829(A) 申请公布日期 1996.07.02
申请号 JP19940314816 申请日期 1994.12.19
申请人 HITACHI CABLE LTD 发明人 SHIMAZAKI HIROAKI;KASHIWAZAKI KATSUMI
分类号 B29C47/02;B29K23/00;H01B3/44;H01B7/02;H01B13/14;H01B15/00;(IPC1-7):H01B13/14 主分类号 B29C47/02
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