| 摘要 |
<p>PURPOSE: To provide a plating jig for semiconductor wafers which prevents the deposition of plating on the peripheral edges of the semiconductor wafers and prevents the dissolution of surface electrodes by contact with different metals. CONSTITUTION: The peripheral edge of the semiconductor wafer 1 where the surface electrodes are exposed is held by an insulating and holding plate 10 and insulating and holding plates l1a, 14b. The surface exclusive of the peripheral edge of the semiconductor wafer 1 is exposed from apertures 15 formed at these insulating and holding plates. The peripheral edge of the semiconductor wafer 1 and the electrodes 19a, 19b for plating held in contact with this peripheral edge are covered by sealing members 17a, l7b to prevent the contact with the plating liquid. As a result, the formation of the plating layer on the peripheral edge of the semiconductor wafer is prevented and the contact of the electrodes for plating with the plating liquid is prevented as well. The dissolution of the surface electrodes by the contact with the different metals is thus prevented.</p> |
