| 摘要 |
PURPOSE: To provide a copper alloy which is used as a blank for electric and electronic parts and has excellent tensile strength, electric conductivity, bending moldability, stress relieving rate and solderability. CONSTITUTION: This copper alloy for electric and electronic parts is composed, by weight, of 0.21 to 0.28% Be, 0.5 to 1.3% Ni and the balance Cu with inevitable impurities and has the material characteristics of the tensile strength of 56 to 66kgf/mm<2> , the electric conductivity of 65 to 70% IACS, the bending moldability (R/t) of <=2, the stress relieving rate of <=20% (200 deg.C×100hr) and the solderability of <=1 second. The solderability is made into <=0.5 second by adding either or both of <=0.2% Sn and <=0.2% Zn to the blank.
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