| 摘要 |
PURPOSE: To obtain a board whose degradation and reforming are prevented during the circuit formation process of a face to be treated by a method wherein a low- temperature plasma treatment is executed to an outer surface in which a polyimide film, a thermosetting adhesive layer and a metal foil have been formed in this order and a semihardened thermosetting adhesive layer and a mold releasing agent are formed on a treated surface. CONSTITUTION: A polyimide 4 is coated with an epoxy-based adhesive, and the adhesive is heated so as to be semihardened. In addition, a rolled copper foil is heated and compression-bonded, a one-sided flexible printed-circuit board 9 is formed, and a low- temperature plasma treatment or a corona discharge treatment is executed to the face of the polyimide film 4. In the low-temperature plasma treatment, a surface treatment is executed in such a way that the one-sided flexible printed-circuit board 9 is put into a plasma treatment apparatus whose pressure can be decreased and that a low-temperature plasma is generated by a glow discharge. The corona discharge treatment is executed in the same process. Then, the face of the polyimide film 4 is coated with the solution of a thermosetting adhesive, a thermosetting adhesive layer 6 in a semihardened state is formed, a rnold releasing agent 7 is overlapped, and a board 10 for multilayer flexible printed wiring is formed. |
