发明名称 |
Flux composition and corresponding soldering method |
摘要 |
A new flux composition, as well as corresponding methods for soldering electronic components to printed circuit boards, is disclosed. The new flux composition includes pimelic acid and two organic solvents. Significantly, the new flux composition leaves essentially no ionic residues at the completion of the soldering processes used to mount electronic components onto printed circuit boards.
|
申请公布号 |
US5531838(A) |
申请公布日期 |
1996.07.02 |
申请号 |
US19950435896 |
申请日期 |
1995.05.05 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ARLDT, ROY L.;DOWNEY, SUSAN H.;GOLDLEN, HARRY J.;MAHMOUD, ISSA S.;OKORO, CLEMENT A.;SPALIK, JAMES |
分类号 |
B23K35/363;B23K35/36;C07C55/16;H05K3/34;(IPC1-7):B23K35/34 |
主分类号 |
B23K35/363 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|