| 摘要 |
PURPOSE: To obtain a printed-wiring board which enhances the through insertion property of conductor bumps and which enhances the connection reliability of a conductor wiring part to a metal foil by a method wherein the conductor bumps as a group are formed by using a conductive composition in which a fiberlike conductive filler at a specific value or higher is mixed with a synthetic resin-based polymer. CONSTITUTION: A thermoplastic acrylic resin-based silver paste A which uses a conductive filler having a length of 4 mm or higher is printed, by using a metallic mask, on an electrolytic copper foil 1 as a support base body so as to be dried, its printing operation is then repeated in the same position by using the same mask, and bumps 2 are formed. As a synthetic resin-based sheet, a prepreg 3 is formed in such a way that a glass cloth is impregnated with an epoxy resin. Then, the prepreg 3 is stacked and arranged so as to be pressurized, the bumps as a group are passed in the thickness direction of the prepreg 3, and a through conductor wiring part is formed. Then, an electrolytic copper foil 4 as a rear sheet is stacked and arranged on the prepreg 3 so as to be heated, pressurized and integrated, and a double-sided printed-wiring board is formed. |
