| 摘要 |
<p>PURPOSE: To control the movement of a conductor part and to prevent the falling off, etc., of an IC chip by making the diameter of the inner part of the through-hole formed in the outermost surface layer of a ceramic multilayer substrate larger than the diameter of the outer part. CONSTITUTION: A glass ceramic material, etc., are used to form plural ceramic layers 81a to 81n, and plural wiring layers 82a to 82n are interposed between the layers by using Cu, etc. Plural through-holes 11 are formed in the outermost surface ceramic layers 81a and 81n, and the diameter D of the inner part 11b of the through-hole 11 is made larger than the diameter (d) of the outer part 11a. Consequently, even if any gap is formed between the through-hole 11, the through-hole 12 formed in the intermediate layer and the conductor parts 13 and 14, the gap is held between the small-diameter through-hole part 11a and the end faces 11d and 12a on the inside of the substrate, and the vertical movement of the conductor parts 13 and 14 is controlled. Accordingly, the falling off, etc., of the conductor parts 13 and 14 are surely prevented.</p> |
