发明名称 Device for aligning contacting portions of contacts in IC socket
摘要 In an IC socket including an IC placing section at a generally central area thereof and a large number of contacts arranged in an array along a pair of opposing sides of the IC placing section, so as to be electrically and physically connected to leads of an IC placed on a socket body, a device for aligning contacting portions of the contacts in the IC socket comprising a ruler plate mounted on the IC placing section, the ruler plate being provided at a pair of opposing sides thereof with grooves or holes for allowing contacting portions of the contacts to be loosely inserted therein and partition walls for isolating the respective adjacent grooves or holes, the ruler plate being fitted to the IC placing section and firmly secured to a predetermined position through positioning means, the contacting portions being inserted respectively in the grooves or holes and side surfaces of the contacting portions being abutted with inner surfaces of the ruler walls at the position where the ruler plate is firmly secured, thereby establishing relative positions of the contacting portions.
申请公布号 US5531603(A) 申请公布日期 1996.07.02
申请号 US19940338737 申请日期 1994.11.09
申请人 YAMAICHI ELECTRONICS CO., LTD. 发明人 KUBO, MASAAKI;HAYAKAWA, NANAHIRO
分类号 H01R33/76;H01L23/32;H01R33/74;H05K7/10;(IPC1-7):H01R9/09 主分类号 H01R33/76
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