| 摘要 |
A process is provided for the production of a base board for printed wiring. The process involves the steps of wrapping a block inorganic continuous porous material with a cloth, impregnating the wrapped block inorganic continuous porous material with a thermosetting resin under reduced pressure, curing the thermosetting resin to form a composite material, and slicing the composite material into base boards having a thickness of 0.2 to 2 mm and a thickness allowance of +/-5 mu m or less, or the steps of impregnating a block inorganic continuous porous material with a thermosetting resin in an impregnation vessel under reduced pressure, taking the block inorganic continuous porous material impregnated from the impregnation vessel, substantially removing the thermosetting resin adhering to surfaces of the block inorganic continuous porous material before the thermosetting resin forms a gel, curing the remaining thermosetting resin under heat to form a composite material, and slicing the composite material into base boards having a thickness of 0.2 to 2 mm and a thickness allowance of +/-5 mu m or less.
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