SEMICONDUCTOR PACKAGE, ITS MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE,申请号JP19940313340-传众专利搜索

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发明名称	SEMICONDUCTOR PACKAGE, ITS MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH08172142(A)	申请公布日期	1996.07.02
申请号	JP19940313340	申请日期	1994.12.16
申请人	NIPPON MICRON KK	发明人	KOMATSU TAKATSUGU
分类号	H01L23/12;H01L23/02;(IPC1-7):H01L23/12	主分类号	H01L23/12
代理机构		代理人
主权项
地址

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