METHOD AND APPARATUS FOR SOLDER LEVELING OF PRINTED CIRCUIT BOARDS

摘要

Disclosed is a mçthod and apparatus for fabricating workpieces such as printed circuit boards which include blowing excess solder off the board by a hot air solder leveling technique. A converging/diverging airknife design creates a shock wave, causing a high pressure, low velocity flow pattern which removes solder from the through-holes in the board while leaving sufficient solder on the surface mount features.