| 摘要 |
PURPOSE: To reduce packaging area and to reduce wiring length by connecting an LSI package onto a printed circuit board three-dimensionally. CONSTITUTION: A plurality of conductive contact parts 12 are installed in the longer direction of the inner-periphery surface of a socket body 11 in square cylindrical shape whose both edges are open. The socket body 11 has a length for piling up at least two LSI packages 10. One edge side of the conductive contact part 12 is a lead part 15 and is connected to a printed wiring 14 of a printed circuit board 13. By packaging this sort of LSI socket 1 for three- dimensional connection onto the printed circuit board 13 and incorporating and packaging a plurality of LSI packages 10 from the other open edge of the socket body 11 so that they can be pushed in, the LSI packages 10 can be connected and connection can be made to the printed wiring 14 via the conductive connection part 12 and a plurality of LSI packages 10 can be packaged with a less area and a short wiring length on the printed circuit board 13. |
