| 摘要 |
PURPOSE: To obtain a shielding plate whose productivity is enhanced and whose costs are lowered by a method wherein an insulating film which has been coated with an adhesive in advance and which comprises a copper foil is laminated continuously to an inner-layer circuit board by means of a heat roll. CONSTITUTION: In an insulating film 4 which comprises a copper foil, a copper foil 1 is bonded to an insulating film 3 via an adhesive 2 for the copper foil. The face of the insulating film for the insulating film 4 which comprises the copper foil is coated with an adhesive 5 so as to be dried and half hardened, and a filmlike laminated body 6 is formed. Then, the filmlike laminated body 6 is wound on winding rolls 10a, 10b so as to be capable of being fed continuously in such a way that the face of the adhesive 5 becomes the outside. In addition, an inner-layer circuit board 9 in which a circuit 8 has been formed on a board 7 is fed continuously, the filmlike laminated body 6 is fed continuously so as to sandwich the surface and the rear surface of the inner-layer circuit board 9, the laminated body is passed between heat rolls 11a, 11b so as to be laminated to both faces of the inner-layer circuit board 9, and a shielding plate 12 for a multilayer printed-wiring board is formed. |
