发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
摘要 PURPOSE: To form an electrode or a wire capable of flowing a large current in a simple device containing no complicated and expensive mechanisms for rotation, revolution, etc., in an element having an undercut on a surface like a semiconductor laser. CONSTITUTION: A semiconductor laser is formed on a substrate with a striped active layer 10, an electrode 12 being an ohmic contact that a current is implanted thereon, a lead-out electrode 13 for connecting therewith, a bonding pad part 14 of the lead-out electrode and a wire part for connecting the electrode 13 therewith. A groove is bored on both sides of stripe and the side surfaces are coated with an insulation film and an injected current is confined. Next, with the use of an electron beam evaporator having high orientation, an electrode and a wire portion are formed by a simple method of irradiating metal particles from upward or aslant upward. At that time, portions that are desired to electrically connect on an element surface are connected between the electrodes on a forward mesa inclined surface so as to see an evaporation source, and portions to be separated are screened for the evaporation source on a reverse mesa inclined surface, make a structure for separation or a connection in self-alignment.
申请公布号 JPH08172242(A) 申请公布日期 1996.07.02
申请号 JP19940333892 申请日期 1994.12.15
申请人 TOSHIBA ELECTRON ENG CORP;TOSHIBA CORP 发明人 FURUKAWA CHISATO;MATSUYAMA TAKAYUKI
分类号 H01L21/60;H01S5/00;H01S5/02;H01S5/042;H01S5/227;H01S5/343 主分类号 H01L21/60
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