| 摘要 |
<p>PURPOSE: To provide a cooling device for a multichip module wherein a micropackage of high heat generation density is not affected by thermal deformation, assembling and dismantling are easy, and cooling performance is excellent. CONSTITUTION: A multichip module 10 consists of a multilayered wiring board 4 on which a micropackage 2 accommodating an LSI chip 1 is mounted, and a housing 11 unified in a body with a cooling device 12. The micropackage consists of a first thermal conductor 6 which consists of a cap part 6b accommodating the LSI chip and a first fin 6a and is formed in an unifird body by using the same material, and a wiring board 14 fixed to a cap part of the first thermal conductor. The LSI chip is mounted on the wiring board 14 fixed to the cap part of the first thermal conductor, and the back of the LSI chip is fixed on the inner surface of the cap part of the first thermal conductor. Second thermal conductor 7 consists of a base part 7b and a second fin 7a, is arranged so as to be engaged with the first fin, and is pressed against a cooling device with a spring 9.</p> |
