| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition excellent in heat resistance, metal foil adhesion, glass transition temperature (Tg), low thermal expansion, elastic modulus, low curing shrinkage, and dielectric characteristics (dielectric constant and dielectric loss tangent) in a high frequency band, and to provide a prepreg, a film with resin, a laminate, and a printed wiring board.SOLUTION: The thermosetting resin composition contains: an amino-modified siloxane compound (I) having an aromatic azomethine group, which is obtained by reacting an aromatic azomethine compound (a) having at least one aldehyde group in one molecule with a siloxane compound (b) having at least two primary amino groups; a maleimide compound (c) having at least two N-substituted maleimide groups; and an allyl compound (d) having two or more allyl groups.SELECTED DRAWING: None |
