发明名称 LAYER STRUCTURE FOR INTEGRATING CO-FIRED MODULE
摘要 <p>PROBLEM TO BE SOLVED: To obtain a coupled multilayer circuit structure integrated to facilitate the fixing of a multilayer structure being used. SOLUTION: A coupled multilayer circuit structure comprises a plurality of flat dielectric layers 11 laminated by pasting to form a base body having a side part 12 formed by the edge part of the dielectric layer, and recessed regions 15, 13 formed on one or the other side of the base body in order to fix the base body to an upper assembly or an electric contact circuit to a coupled multilayer circuit structure.</p>
申请公布号 JPH08172275(A) 申请公布日期 1996.07.02
申请号 JP19950219284 申请日期 1995.08.28
申请人 HUGHES AIRCRAFT CO 发明人 BURAIAN DEII YANGU
分类号 H05K1/14;H01L23/13;H01L23/538;H05K1/00;H05K1/03;H05K1/18;H05K3/34;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/14
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