发明名称 LASER SOLDERING APPARATUS
摘要 PURPOSE: To obtain a laser soldering apparatus by which the spot position of a laser beam radiated from a lens system is adjusted easily. CONSTITUTION: In a laser soldering apparatus, leads 5 for an electronic component 1 are soldered onto electrodes on a printed-circuit board 3 with solder supplied in advance in such a way that the leads are irradiated with a laser beam while the leads are being pressed one by one. The laser soldering apparatus is constituted of fibers 9 which introduce laser beams from ends on one side, of lens systems 10 which condense the laser beams radiated from ends, on the other side, of the fibers, of housings 11 which hold the lens systems, of couplers 12 for mounting of the fibers, which are installed at the housings and of slide fine-adjustment mechanisms 13 which can move the couplers relatively with the lens systems at the inside of planes in which image formation positions in the direction of every optical axis by the lens systems at the ends, on the other side, of the fibers are not changed.
申请公布号 JPH08172262(A) 申请公布日期 1996.07.02
申请号 JP19940317155 申请日期 1994.12.20
申请人 NEC CORP 发明人 KUBOTA NORIYUKI
分类号 B23K26/04;B23K1/005;B23K26/06;B23K26/08;H05K3/34 主分类号 B23K26/04
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