发明名称 Mehrpoliges, oberflächenmontierbares, elektronisches Bauelement
摘要 A multipolar, surface-mountable electronic component e.g. a radiation emitter, comprising an electronic module 8 positioned in a housing 7 has contact surfaces which extend completely or partially around it on several sides. The electronic module and the housing are connected to a carrier strip 1 which forms the terminals 17, 18, the contact surfaces of which are shaped in such manner that they can completely or partially surround the entire housing 7. The module may also include a lens formed by shaping an epoxy resin filling in the opening 9. The carrier strip may have a positioning mark 2. The contacts 17, 18 are separated from each other by severing the carrier strip portions at punched cut-outs 5, and the completed component may be mounted on a pcb. <IMAGE>
申请公布号 DE4446566(A1) 申请公布日期 1996.06.27
申请号 DE19944446566 申请日期 1994.12.24
申请人 TEMIC TELEFUNKEN MICROELECTRONIC GMBH, 74072 HEILBRONN, DE 发明人 NATHER, HEINZ, DIPL.-PHYS. DR.RER.NAT., 74199 UNTERGRUPPENBACH, DE;MUEHLECK, PETER, DIPL.-ING., 74254 OFFENAU, DE
分类号 H01C1/14;H01G4/228;H01L23/495;H01L33/48;H05K1/18;(IPC1-7):H01L23/495;H01L23/043;H01G2/06;H01L33/00 主分类号 H01C1/14
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