| 发明名称 |
Directly connecting planar bodies, substrate and contact plates |
| 摘要 |
Process for directly connecting planar bodies, substrate plate and a contact plate, all having particularly flat surfaces comprises flattening the roughness in the surfaces of both plates to be joined, up to a depth of less than 10 mu m, cleaning the surfaces, and directly stacking them on each other. Also claimed is an object having two bodies, having at least two planar surfaces bordering each other.
|
| 申请公布号 |
DE4445348(A1) |
申请公布日期 |
1996.06.27 |
| 申请号 |
DE19944445348 |
申请日期 |
1994.12.20 |
| 申请人 |
DAIMLER-BENZ AKTIENGESELLSCHAFT, 70567 STUTTGART, DE |
发明人 |
WALLISER, DIRK, DR.RER.NAT., 73732 ESSLINGEN, DE;GUETTLER, HERBERT, DR.RER.NAT., 70567 STUTTGART, DE |
| 分类号 |
B23K20/24;H01L21/18;H01L21/20;H01L21/58;H01L21/98;(IPC1-7):H01L21/60 |
主分类号 |
B23K20/24 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
